Continuous unloading and packaging system of pharmaceutical additive manufacturing
US12168538B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2021 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Aug 3, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/753
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A high throughput, efficient, and simplified unloading and packaging systems and methods for large-scale production of pharmaceutical units (104) using additive manufacturing. The systems and methods may unload, inspect, package, and trace pharmaceutical units, produced by an additive manufacturing system (900), that are not damaged or deformed. The unloading and packaging system can include one or more unloading and packaging devices (100). The unloading and packaging device can include a modular configuration having modules. Individual modules to be arranged in any relative order, at any location, and with any number in the unloading and packaging device. The flexibility of the modular configuration allows one or more modules to be removed or added at any given time due to, e.g., expansion, downsizing, module repair, module upgrades, etc. High throughput can be achieved by operating unloading and packaging devices independently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.