Adhesive resin compositions and laminates
US12168738B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2020 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Oct 24, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive resin composition including a propylene polymer (A), an ethylene polymer (B), and a thermoplastic resin (C) including a copolymer containing not less than 60 mol % and not more than 99 mol % of structural units derived from 4-methyl-1-pentene, and not less than 1 mol % and not more than 40 mol % of structural units derived from a C2-C20 α-olefin other than 4-methyl-1-pentene, these structural units representing total 100 mol % of the copolymer, the thermoplastic resin (C) showing a melting point Tm of not more than 199° C. or showing substantially no melting point as analyzed with a differential scanning calorimeter (DSC). The total of the components (A), (B) and (C) includes 45 to 75 parts by mass of the component (A), 5 to 20 parts by mass of the component (B), and 15 to 45 parts by mass of the component (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.