Manufacture of surface relief structures
US12169359B2 · kind B2 · utility
0Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2020 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Dec 13, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/1857
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and apparatus for the etching of variable depth features in a substrate is described. Movement of the substrate relative to an etchant (e.g. into or out of the etchant) during the etching process is utilised to provide a varying etch time, and hence depth, across the substrate, and in various examples this is enabled without requiring a varying mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.