Exposure control in photolithographic direct exposure methods for manufacturing circuit boards or circuits

US12169370B2 · kind B2 · utility

Assignee

• Laser Imaging Systems GmbH · DE

Inventors

• Christian Schwarz · Vuarrengel, CH
• Jonas Burghoff · Apolda, DE
• Stefan Heinemann · Ann Arbor, US
• Holger Wagner · Mettenberg, DE
• Steffen Rücker · Großlöbichau, DE
• Frank Jugel · Erfurt, DE

Key dates

• Filing date: Sep 15, 2021
• Grant date: Dec 17, 2024
• Expiry date: Sep 15, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F9/7026
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The invention is directed to a device for exposure control in photolithographic direct exposure processes for two-dimensional structures in photosensitive coatings and to a method for converting registration data into direct exposure data. The object of the invention, to find an improved exposure control in direct exposure methods for two-dimensional structures in photosensitive layers which permits a registration of target marks independent from defined locations of the target marks, is met according to the invention in that a plurality of entocentric cameras are arranged in a registration unit (1) in linear alignment transverse to the one-dimensional movement of the substrate (2) to form a gapless linear scanning area (23) over a predetermined width of the substrate (2). The angles of view of adjacent entocentric cameras have an overlapping region along the linear scanning area (23) in which redundant image captures of the substrate (2) of the adjacent cameras (11) are detectable, and the computing unit (5) has means for calculating the position of the target marks from the redundant image captures of the adjacent entocentric cameras additionally using a height position of the ta…