Gimbal bonding tool and a method to correct surface non-uniformities using a bonding tool
US12170212B2 · kind B2 · utility
0Cited by
9References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 16, 2022 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Mar 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a method and apparatus to correct surface non-uniformities between a donor substrate and a system substrate using a bonding tool. The bonding tool has multiple segments with internal structure to facilitate the objective. In particular, arc shaped guideways and resulting movements exemplify the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.