Assembly having a solder pin and a solder point
US12170431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2020 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Jul 30, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An assembly is provided. The assembly includes a component, a solder pin arranged on the component, an electrical structural unit, and a soldering point which is arranged on the electrical structural unit and forms an opening, into which the solder pin is insertable along an insertion direction in order to produce a soldered joint. The solder pin has an insertion portion which, on sides of the solder pin that face away from each other, forms insertion walls which are arranged at an acute angle to one another in such a way that the insertion portion tapers in the insertion direction. A part of the insertion portion is arranged outside the opening in such a way that one or more portions of the insertion walls extend inside the opening and one or more portions of the insertion walls extend outside the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.