Wireless headset
US12170868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2020 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | May 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.