Electronic assembly and method for thermal balancing of surfacemount devices
US12171056B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Jun 20, 2022 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Feb 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device may include a printed circuit board (PCB), a plurality of surface-mount devices disposed on the PCB, wherein a thermal mass of each of the surface-mount devices ranges between a first thermal mass value and a second thermal mass value that is greater than the first thermal mass value, and a plurality of thermal capacitors disposed on the PCB, wherein a thermal mass of each of the thermal capacitors is equal to or greater than the first thermal mass value of the surface-mount devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.