Interconnect and method for manufacturing the same
US12171064B2 · kind B2 · utility
0Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2021 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Sep 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10318
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnect is provided that can comprise a recess formed in a body where the recess comprises an axial end wall and a side wall extending from the axial end wall. The interconnect can also comprise a distributed metallized layer disposed on the axial end wall and the side wall and a conductive compliant (CC) plug disposed within the recess to interface with the metallized layer. The CC plug can be configured to establish an electrical connection between a conductive pad disposed on the recess and a male conductive element inserted into the recess via the metallized layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.