Flexible OLED substrate and encapsulation method thereof
US12171113B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Nov 26, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
Abstract
A flexible organic light-emitting diode (OLED) substrate includes a flexible substrate, an inorganic barrier layer, an OLED device, and an adhesive-filling layer. The inorganic barrier layer is disposed on the flexible substrate. The OLED device is disposed on the inorganic barrier layer. The adhesive-filling layer covers the OLED device and the inorganic barrier layer. The flexible substrate further comprises a base substrate, a bending portion, and a covering portion. A thin film transistor layer is disposed on the base substrate, and the bending portion is connected to the base substrate and the covering portion. The covering portion covers the adhesive-filling layer and is stacked above the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.