Solar cell cutting and passivation integrated processing method and solar cell thereof
US12171136B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2020 |
| Grant date | Dec 17, 2024 |
| Priority date | — |
| Expiry date | Dec 9, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are a solar cell cutting and passivation integrated processing method and a solar cell prepared using the method. The solar cell includes a substrate (1), a front electrode layer (2), a light absorption layer (3) and a back electrode layer (4) from bottom to top. Before laser structured cutting is performed for the back electrode layer (4), a protective layer (5) is disposed on a surface of the back electrode layer (4), and then laser structured cutting is performed for the back electrode layer (4), or the back electrode layer (4) and the light absorption layer (3) simultaneously through the protective layer (5) to obtain a corresponding structured trench (P3) while the protective layer (5) is kept from being cut by laser, and a material of the protective layer (5) is partially molten due to a localized high temperature generated by the laser processing in a laser structured cutting process and infiltrates into an underlying corresponding structured trench (P3). In this method, at the time of performing laser cutting processing, passivation is performed for newly-processed trench at the same time, reducing production costs, saving processing time. Further, the trench edge…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.