Thermal platform and a method of fabricating a thermal platform
US12172168B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jan 17, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2300/1883
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A microfabricated thermal platform can be formed over a substrate, such as a silicon wafer, that may form part of the platform. The substrate is coated in a thermally-insulating material, which may be an organic polymer such, as polyimide or SUS. The surface of the thermally-insulating material may include an arrangement of one or more thermal sites, with each site having a reaction plate (or thermal plate) over which chemical reactions may occur. A heating element may be positioned beneath each reaction plate. A fluidic medium, such as a liquid or a gas, may be disposed over the thermal sites. One application is in chemical and biological reactions. In such reactions, the fluidic medium may be an aqueous solution which comprises reagents for those reactions. The fluidic medium may be an ionically conducting fluid, organic solution or a gas. Precise temperature control enables the correct reactions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.