Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding
US12172189B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jan 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.