Substrate processing apparatus and substrate alignment method using the same
US12172313B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Apr 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method includes performing a substrate processing process by carrying a substrate into a chamber, and disposing the substrate in a loading region of the chamber, capturing an image of a lower surface of the substrate to acquire a first image, identifying particle patterns formed on the lower surface of the substrate in the substrate processing process, and an edge of the substrate, from the first image, calculating a first alignment error value of a deviation between an approximate position value for the center of the loading region calculated from the particle patterns and an approximate position value for a center of the substrate calculated from the edge of the substrate, and determining a point in time for teaching a transfer robot that deposits the substrate into the chamber, based on the first alignment error value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.