Feedthroughs for enclosures in deep water vessels
US12172741B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 2023 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Oct 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/20
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An enclosure structure suitable for high-pressure environments includes a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure. The enclosure structure includes a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing and a bore through the housing. The one or more electronic components comprises a connector element and the bore comprises a non-tapered portion and a tapered portion. The non-tapered portion is proximate to the interior of the housing and the tapered portion is proximate to the exterior of the housing. The bore is configured to receive a feedthrough pin for coupling the connector element to an external component external to the enclosure structure. The enclosure structure also includes a feedthrough pin extending through the bore and a potting material disposed within the tapered portion surrounding the feedthrough pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.