Method for coating resin molded product
US12173190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2021 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Apr 19, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/003
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure keeps a topcoat film 3 from having a dent 6 in a portion of its surface corresponding to a pinhole 4 of a resin molded product 1. A method of the present disclosure includes: applying an undercoat material to a resin molded product 1 to form an undercoat film 2; applying a topcoat material to a surface of the undercoat film 2 to form a topcoat film 3; and thermally curing the topcoat film 3. A coating material that contains a base resin having a larger volume expansion coefficient than the resin molded product 1 and a granular filler having a smaller volume expansion coefficient than the base resin and a number-average particle size of 2 μm or more to 12 μm or less is used as the undercoat material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.