Copper-clad laminate and method of forming the same
US12173201B2 · kind B2 · utility
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40References
20Claims
0Family size
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Key dates
| Filing date | Dec 9, 2021 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Dec 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0266
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.