Patent · US Active

Sputtering target

US12173397B2 · kind B2 · utility

0Cited by

7References

19Claims

0Family size

Assignee

CemeCon AG · DE

Inventors

Oliver Lemmer · Aachen, DE
Werner Kölker · Ratzeburg, DE
Jürgen Balzereit · Würselen, DE
Stephan Bolz · Pfatter, DE

Key dates

Filing date	Feb 22, 2022
Grant date	Dec 24, 2024
Priority date	—
Expiry date	Feb 22, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3429
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The invention relates to a sputtering target, a coating system, and a coating method for same. The sputtering target comprises a base plate with a target plate which is secured thereon and which is made of a first sputtering material with a surface and a plurality of recesses formed therein. A plurality of inserts are arranged in the recesses. At least some of the inserts are made of a second sputtering material, wherein the second sputtering material has a higher sputter yield than the first sputtering material. The aim of the invention is to achieve especially uniform coatings. This is achieved in that the inserts made of the second sputtering material are shaped such that the extent D1, D2 of the inserts, measured in a measuring direction parallel to the surface, increases from the surface to the base plate in a depth direction T.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.