Patent · US Active

Method for producing a sensor device and component and/or chassis component comprising a sensor device of this kind

US12174078B2 · kind B2 · utility

1Cited by

0References

9Claims

0Family size

Assignee

ZF FRIEDRICHSHAFEN AG · DE

Inventors

Michael Klank
Thomas Koehne · Osnabrück, DE

Key dates

Filing date	Feb 21, 2020
Grant date	Dec 24, 2024
Priority date	—
Expiry date	May 30, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/3406
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method for producing a sensor device (2) for the measurement of an instantaneous load on a component (1, 15), in which the component (1, 15) is made of plastic, in which a sensor layer (3) is arranged in the component (1, 15). The sensor layer (3) is formed of a carrier material with electrically conductive particles embedded therein. To be able to measure or determine loads and/or forces in the component (1, 15) in a better an/or more reliable way, the method includes forming at least one blind hole-like recess (4) in the component (1, 15) to receive the sensor layer (3).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.