High resolution multispectral multi-field-of-view imaging system for wafer inspection
US12174128B2 · kind B2 · utility
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6References
20Claims
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Key dates
| Filing date | Sep 8, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Dec 6, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/1006
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An optical system and design can image objects under inspection in the ultraviolet (UV) and visible spectrums. This imaging can be used to detect both large defects in the visible spectrum and small defects in the UV spectrum in a single pass while reducing the time and cost of the inspection process. The optical system may include an off-axis reflective focusing system for aberration correction with a beamsplitter to separate the visible spectrum from the UV wavelengths. Cameras may then image visible and UV wavelengths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.