Photonic integrated circuit platform and optical phase array device using the same
US12174416B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2023 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Nov 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/50
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit platform includes a substrate, a first oxide layer disposed on the substrate and including an insulating transparent oxide, and a first optical element layer disposed on the first oxide layer and including a semiconductor material. The photonic integrated circuit platform further includes a second optical element layer disposed on the first optical element layer and including an insulating material different from the insulating transparent oxide of the first oxide layer, the second optical element layer further including a compound semiconductor material different from the semiconductor material of the first optical element layer, a second oxide layer disposed on the second optical element layer and including an insulating transparent oxide, and a plurality of optical elements formed by patterning the first optical element layer or the second optical element layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.