Thin film lithium niobate hybrid photonics packaging
US12174419B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2023 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jun 12, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0018
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A hybrid photonics device package is described. The hybrid photonics device package includes an electro-optic integrated circuit and a photonics integrated circuit. The electro-optic integrated circuit includes an optical structure and an electrode on a first substrate. The optical structure has a thin film electro-optic layer including lithium. The photonics integrated circuit includes a second substrate and a photonics component on the second substrate. The photonics component and the optical structure are optically coupled. One of the electro-optic integrated circuit and the photonics integrated circuit is mounted on an other of the electro-optic integrated circuit and the photonics integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.