Optoelectronic device and method of manufacture thereof
US12174424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Sep 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/824
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing an optoelectronic device. The manufactured device includes a photonic component coupled to a waveguide. The method comprising: providing a device coupon, the device coupon including the photonic component; providing a silicon platform, the silicon platform comprising a cavity within which is a bonding surface for the device coupon; transfer printing the device coupon onto the cavity, such that a surface of the device coupon directly abuts the bonding surface and at least one channel is present between the device coupon and a sidewall of the cavity; and filling the at least one channel with a filling material via a spin-coating process, to form a bridge coupling the III-V semiconductor based photonic component to the silicon waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.