Formation of three-dimensional structures using grey-scale photolithography
US12174548B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2019 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Sep 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/331
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Forming a three-dimensional structure includes applying photoresist on a layer and using a photolithography system to expose the photoresist. The photolithography system includes a photomask having a pattern thereon, where the pattern provides varying pattern density across a surface of the photomask and has a pitch that is less than a resolution of the photolithography system. The method includes subsequently developing the photoresist such that photoresist remaining on the layer has a three-dimensional profile defined by the photomask. An isotropic etchant is used to etch the layer such that the three-dimensional profile of the photoresist is transferred to the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.