Grinding and polishing simulation method and system and grinding and polishing process transferring method
US12174596B2 · kind B2 · utility
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4References
15Claims
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Key dates
| Filing date | Dec 28, 2020 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jan 21, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B17/00
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.