Double-sided copper-clad laminate
US12176150B2 · kind B2 · utility
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3References
10Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 4, 2023 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Apr 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 μm or more and 3.3 μm or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.