Ceramic electronic device and manufacturing method of the same
US12176152B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Aug 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic electronic device includes a multilayer structure having a substantially rectangular parallelepiped shape, a first cover layer, and a second cover layer that is provided on a second end of the multilayer structure in the stacking direction, a main component of the second cover layer being ceramic, a porosity of the second cover layer being higher than that of the first cover layer. Q=(A+B)/2C×100(%) is 0.5% or more and 1.6% or less, when, at an interface of the second cover layer on a side of the first cover layer, two heights of curvature portions of both ends of the interface are respectively a height A and a height B, and a shortest height from the first cover layer to the second cover layer is a height C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.