Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
US12176236B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Feb 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3345
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device manufacturing apparatus according to an embodiment includes: a chamber; a holder provided in the chamber and capable of adsorbing a substrate, the holder including a recess on a surface, a first hole provided in the recess, and a second hole provided in the recess; a first gas passage connected to the first hole; a second gas passage connected to the second hole; a first valve provided in the first gas passage; a second valve provided in the second gas passage; a first gas supply pipe for supplying a first gas to the recess; and a gas discharge pipe for discharging a gas from the recess. The first gas passage and the second gas passage are connected to the first gas supply pipe, or the first gas passage and the second gas passage are connected to the gas discharge pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.