Method and device for predicting inclination angle, and method and device for monitoring etching device
US12176252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2021 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Feb 6, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for predicting an inclination angle of an etched hole can include operations as follows. A preset change range of an etching rate of an etching device for an object to be etched on a surface of a monitored sample in different operation stages is determined. An etching rate change curve of the etching device for the object to be etched on the surface of a monitored sample in a current operation stage is acquired. When the etching rate change curve exceeds the preset change range, it is determined that an inclination angle of an etched hole of an etched product currently etched by the etching device exceeds a preset angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.