Semiconductor laser device
US12176675B2 · kind B2 · utility
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2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2019 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Aug 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser device is configured so that, on at least one of the respective opposing surfaces of a semiconductor laser chip and a sub-mount and the respective opposing surfaces of the sub-mount and a heatsink, one or more treatment regions are provided where adhesion of a bonding material or bonding material used for their bonding is reduced, wherein the one or more treatment regions are placed to define, in a traveling direction of light, different coverages depending on a position in an array direction of multiple light emitting regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.