Camera module
US12177554B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 25, 2024 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jan 25, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.