Airflow in a card-based computing device
US12177961B2 · kind B2 · utility
0Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jun 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to various embodiments, a processing subsystem includes: a processor mounted on a first printed circuit board that is oriented parallel to a first plane; a heat sink thermally coupled to the processor; a second printed circuit board that is communicatively coupled to the first printed circuit board and oriented parallel to a second plane, wherein the second plane is not parallel with the first plane; and at least one cooling fan that is positioned to direct a cooling fluid through the heat sink in a direction parallel to the first plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.