Light board, method for manufacturing the same, and LED backlight module and LED backlight device
US12177966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2022 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Dec 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.