Support substrate and method for producing a support substrate
US12177970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2021 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Oct 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2063
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.