Patent · US Active

Component and method for manufacturing a component

US12177986B2 · kind B2 · utility

0Cited by

11References

14Claims

0Family size

Assignee

TDK Electronics AG · JP

Inventors

Jan Ihle · Grambach, AT
Thomas Bernert · Freiland bei Deutschlandsberg, AT
Stefan Endler · Graz, AT
Michael Krenn · Zettling, AT
Stephan Bigl · Graz, AT
Markus Puff · Graz, AT
Sebastian Redolfi · Graz, AT

Key dates

Filing date	Oct 12, 2020
Grant date	Dec 24, 2024
Priority date	—
Expiry date	Aug 29, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/341
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.