Boiler enhancement coatings with active boiling management
US12178005B1 · kind B1 · utility
0Cited by
2References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2023 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Jun 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.