Microchannel heat sink device
US12178006B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2021 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Sep 28, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F3/12
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device including a microchannel heat sink having a first layer circle A and circle B fins and a second layer circle A and circle B fins, wherein circle A fins includes a plurality of outer ring fins and circle B fins includes a plurality of inner ring fins; a cover assembly, in which the cover assembly includes adaptors, a liquid channel, a vapor channel, and a TRV chamber; a thermal regulation valve (TRV), wherein the thermal regulation valve (TRV) is configured to enable dynamic responses for temperature control in the microchannel heat sink; and a temperature sensing mechanism, in which the temperature sensing mechanism is configured to be operable for detecting temperature variations and converting the temperature variations to pressure variations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.