Liquid-cooling heat dissipation apparatus, liquid-cooling data processing device and temperature equalization method
US12178009B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2021 |
| Grant date | Dec 24, 2024 |
| Priority date | — |
| Expiry date | Oct 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20281
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed in embodiments of the present application are a liquid-cooling heat dissipation apparatus, a liquid-cooling data processing device and a temperature equalization method. The liquid-cooling heat dissipation apparatus includes a housing unit and a first liquid-cooling plate arranged in the housing unit. A first electronic unit and a second electronic unit are arranged on a first cooling surface and a second cooling surface arranged oppositely of the first liquid-cooling plate respectively, and the first electronic unit and the second electronic unit may be, for example, hashboards, that is, in the liquid-cooling heat dissipation apparatus provided in the embodiment of the present application, one liquid-cooling plate is correspondingly provided with two hashboards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.