Electronic assemblies including a conformal moisture barrier
US12178398B2 · kind B2 · utility
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1References
20Claims
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Key dates
| Filing date | May 30, 2023 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | May 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method includes forming, by atomic layer deposition, a first barrier layer on a surface of a printed circuit board (“PCB”) and on an outer surface of an electrical component attached to the surface of the PCB; forming an adhesion promotion layer on a surface of the first barrier layer; and forming, on the adhesion promotion layer, a second barrier layer including Parylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.