Method for the material-removing laser machining of a workpiece
US12179287B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2019 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Nov 22, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for the material-removing machining of a workpiece by laser beam pulses. The laser beam pulses are directed to impact points on the surface of a volume to be removed of the workpiece in order to cut away material from the volume to be removed. Cutting away the volume to be removed results in a new contour surface to be produced on the workpiece. An impact angle of the laser beam pulses relative to the contour surface to be produced is set in accordance with a predefined condition during the removal of at least part of the volume to be removed that directly adjoins the contour surface to be produced. According to this condition, the impact angle is the same as a threshold angle (as), or somewhat smaller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.