Tire assembly with circumferential shape memory alloy configuration
US12179525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2023 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Dec 20, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60C2200/12
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A tire assembly that includes a tread portion, a rim, and at least a first band assembly positioned between the tread portion and the rim. The first band assembly includes a first SMA element having an outer surface and a first bead member having an outer surface. The first SMA element extends circumferentially about the tire assembly and the first bead member extends circumferentially about the tire assembly. The first band assembly also includes a plurality of fiber reinforcement members. Each of the plurality of fiber reinforcement members extend around the outer surface of the first SMA element and the outer surface of the first bead member to form the first band assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.