Insulating substrate and power module using the same
US12183654B2 · kind B2 · utility
1Cited by
1References
14Claims
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Key dates
| Filing date | Jul 6, 2023 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Jul 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal spreader of a plurality of inner thermal spreader is inserted into the inner metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.