Hybrid metal line structure
US12183671B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2023 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | May 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53295
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an integrated chip that includes a substrate, a first metal line, and a hybrid metal line. The first metal line includes a first metal material and is within a first interlayer dielectric (ILD) layer over the substrate. The hybrid metal line is also within the first ILD layer. The hybrid metal line includes a pair of first metal segments that comprise the first metal material. The hybrid metal line further includes a second metal segment that comprises a second metal material that is different from the first metal material. The second metal segment is laterally between the pair of first metal segments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.