Chip package structure with ring-like structure
US12183709B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2023 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Dec 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.