Drive backplane, manufacturing method thereof and display panel
US12183863B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Apr 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure discloses a drive backplane, a manufacturing method thereof and a display panel. The drive backplane includes: a base substrate; a first conductive layer, located on the base substrate; a first flat layer, located in a region, other than a pattern of the first conductive layer, on the base substrate; a second flat layer, located on a side, facing away from the base substrate, of the first conductive layer and the first flat layer, where the second flat layer includes a plurality of first via holes; and a second conductive layer, located on a side, facing away from the base substrate, of the second flat layer, where a pattern of the second conductive layer is electrically connected with the pattern of the first conductive layer through the first via holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.