Filter radio frequency module packaging structure and method for manufacturing same
US12184253B2 · kind B2 · utility
0Cited by
1References
18Claims
0Family size
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Key dates
| Filing date | Jul 27, 2021 |
| Grant date | Dec 31, 2024 |
| Priority date | — |
| Expiry date | Jul 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0021
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A filter radio frequency module packaging structure and a method for manufacturing same is disclosed. A first filter chip of the filter radio frequency module packaging structure comprises a chip main body and a wall structure. The wall structure, the functional surface, and a substrate together define a closed cavity, or the wall structure and the functional surface together define a closed cavity. An encapsulation material wraps the first filter chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.