Branched proximal connectors for high density neural interfaces
US12186570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2022 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jan 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.