Mold pump
US12186801B2 · kind B2 · utility
0Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Sep 25, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04D15/0066
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A molding machine for molding material is provided. The machine includes a cavity to be filled with molten metal and a conduit system leading to the cavity, thus forming a system of interconnected hollow spaces. At least one pressure member is moveable in at least part of the conduit system. A centrifugal pump in fluid communication with a reservoir of molten metal is provided, the pump providing molten metal to the hollow space receiving the at least one pressure member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.