Selective field-assisted machining system
US12186847B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 25, 2023 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Dec 25, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23P23/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a selective field-assisted machining system. The system includes a micron-level high-speed identification module, an in-situ laser assisted module, an ultrasonic vibration module, an energy field loading high-speed control module, and a diamond tool. The micron-level high-speed identification module is used to quickly identify the type of a material substrate of a workpiece to be processed, process the identification information into a corresponding control signal, and send same to the energy field loading high-speed control module to implement selective processing of the workpiece to be processed, i.e. to process brittle particles using in-situ laser assisted machining and to process a soft metal substrate using ultrasonic vibration processing. In the present invention, ultra-precision cutting of brittle particles and a soft metal substrate can be completed at the same time in a single processing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.