Methods and compositions for photopolymerizable additive manufacturing
US12187822B2 · kind B2 · utility
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11References
18Claims
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Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | May 5, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/325
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure is directed to methods and compositions comprising photopolymerizable compositions for use in additive manufacturing, particularly for digital light processing, stereolithography or continuous liquid interface processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.